In the CPU air cooling market of industrial all-in-one machines, there are mainly two types of air cooling heat dissipation. One is the downward pressure heat sink, which dissipates the temperature on the CPU through the form of cold air blowing into the chassis. The internal temperature is still stored in the chassis, which is mainly used for common users. The other is the side blowing type, this radiator is generally used in the middle and high-end platform, very suitable for enthusiasts and game fans. Its heat dissipation principle is the heat transfer through the heat conduction tube scales distribution, through the fan will blow out its heat.
Air cooling cooling technology is widely used in desktop computers and industrial all-in-one machines, and is also a relatively mature cooling technology. The following touch like intelligence to introduce the specific way of industrial all-in-one CPU air cooling heat dissipation.
1. Downward pressure radiator: Downward pressure radiator, as the name implies, radiator through direct blowing CPU heat dissipation effect, heat dissipation mode from fan direct blowing radiator gradually evolved into the popular heat pipe heat conduction heat dissipation, because heat pipe heat conduction efficiency is higher, so the heat dissipation efficiency is more efficient than the heat sink heat conduction mode.
The heat sink is mainly composed of heat dissipation fan, heat dissipation fin and heat pipe. In the past, direct fan cooling fin design was used, with limited cooling efficiency; Heat pipe is now used to dissipate heat, through the heat conduction fluid in the copper tube to transfer heat to the heat fin, higher efficiency, heat dissipation effect is more obvious.
At present, the heat sink material is mainly copper and aluminum, both have advantages and disadvantages. Copper has high thermal conductivity, but it is not easy to process and the price is expensive. Aluminum is aluminum alloy process, easy to process and cheap, but relative to copper thermal conductivity efficiency is much lower.
The downward pressure heat dissipation fan directly blows the heat sink downward and the air volume can direct to the CPU and other components of the surrounding motherboard. The advantage of this heat dissipation method is that it can cool the CPU at the same time, the fan can also bring certain heat dissipation effect for the north bridge and memory of the motherboard, so as to effectively protect the motherboard; In addition, the fan directly blows the CPU for secondary heat dissipation. Because the height of the sink radiator is small and the space requirement for the chassis is low, the sink radiator is suitable for small chassis such as the MINI chassis.
Of course, the pressure heat dissipation is subject to the temperature of the chassis, the heat dissipation effect will have a certain impact; And because the fan blows to the motherboard, it is easy to cause hot air accumulation and poor discharge, so it is necessary to build a good chassis air duct to assist the escape of hot air.
2, side blowing radiator: side blowing heat dissipation through the tower structure radiator and heat conduction tube heat conduction, the fan side blowing heat dissipation fin way for heat dissipation, because the tower radiator, the heat dissipation area is larger, auxiliary multiple pipes, heat dissipation efficiency is more obvious.
The side-blowing radiator effectively solves the problem of heat accumulation in the chassis. The side-blowing fan and the chassis fan frame form an air duct system, which can effectively discharge the heat generated by the CPU. And because of the high tower radiator, the heat dissipation area is larger, and the heat dissipation efficiency is higher.
The number of heat pipes of side-blown radiators affects the thermal conductivity efficiency and thus the overall heat dissipation efficiency. However, the CPU size is small and the contact surface is limited, so too many heat pipes will cause waste. At present, the mainstream radiators mostly adopt the design of three or four tubes, which can effectively improve the heat dissipation efficiency. In addition, the design of direct contact between heat pipe and CPU can closely fit heat pipe and CPU, effectively improve thermal conductivity efficiency and strengthen heat dissipation, which is now a design that some mainstream manufacturers have begun to promote.
Side-blowing heat dissipation focuses on heat dissipation for the CPU, thus improving the stability of the CPU operating temperature. The side-blowing fan is effectively connected with the chassis fan to form an overall air duct, which improves the overall heat dissipation effect. However, the heat sink and fan in the side-blowing mode are tall towers, which requires high space for installing the chassis. In addition, the installation on top of the CPU may prevent the installation of memory with high heat dissipation.
Pressure side blow not tangled, suitable. Air cooling heat dissipation is also related to the speed, wind pressure and air volume of the cooling fan. It is also necessary to choose a good cooling fan. High speed to provide large air volume; The reasonable design of the fan blade can effectively gather the air volume, form a large wind pressure, blow through the heat fin; Intelligent speed control is supported to balance heat dissipation and noise reduction. These are also factors that should be considered when choosing an air-cooled radiator. The side-blown radiator has high heat dissipation efficiency, which can effectively suppress the CPU temperature and maintain long-term stable operation. The down-pressure heat sink can cool the CPU and other components on the mainboard at the same time, providing a wider heat dissipation range.
Post time: Nov-29-2022